SX-SDPAC System-in-Package (SiP)

802.11a/b/g/n/ac SDIO System-in-Package (SiP)

The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SDIO SiP module specifically designed for low cost high volume embedded applications.

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Top Features:

  • Lowest cost 802.11a/b/g/n/ac implementation
  • Smallest footprint for space constrained devices
  • Wave 2 MU-MIMO (Client Side) Support

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Applications:

Silex SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SDIO SiP module based on the Qualcomm Atheros QCA9377 System-on-Chip (SoC) for portable battery operated electronic devices. The SX-SDPAC brings 802.11ac throughput and range to portable devices including patient monitors, printers, handheld terminals and more.

The SX-SDPAC is a System-in-Package (SiP) designed to be mounted directly on the device PCBA. This design approach minimizes cost by eliminating extra materials (i.e. PCB and connectors) and labor associated with a radio module or card.

Wireless Driver Options:

  • Linux (kernel 4.1)
  • Windows (WEC7, WEC2013, Win10/10IoT)
  • Android (Lollipop, Marshmallow, Nougat)

Features and Benefits:

  • Low Power Dual-Band 1x1 SiP Module for Wi-Fi & BT
  • Based on the QCA9377 Chipset
  • 802.11 a/b/g/n/ac Wave 2 MU-MIMO
  • Standard and High-Speed BT
  • SDIO 3.0 WLAN Host Interface
  • UART/PCM BT Interface
  • On-chip Power Management Unit (PMU)
  • Single 3.3V Supply (I/O Supply 1.8V or 3.3V)
  • Internal 48 MHz XTAL
  • Optional Antenna Diversity Support
  • Single-ended Integrated RF Front-end Design
  • Minimal host utilization (11ac speeds) via offloading
  • Land-grid-array (LGA) Package 6.9 mm x 6.9 mm x 1.082 mm

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SX-SDPAC Mechanical1SX-SDPAC Mechanical2

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General Specifications

 Items

 Specifications

 Units 

 Remarks

 Pin Connections

 80 pins

-

 Device Interfaces

 SDIO v3.0

 -

 For Wireless LAN

 UART

 -

 For Bluetooth

 RF Interface

 IEEE802.11a/b/g/n/ac

 -

 IEEE802.11-2012/IEEE802.11ac-2013

 Bluetooth 4.1 BR/EDR/LE Smart Ready 

 -

 Dimensions

 L x W x H

 6.9 x 6.9 x 1.082

 mm

Environmental Specifications

 Items

 Specifications

 Units 

Remarks

 Operating Temperature

 -20 ~ +70

 ℃

 Ambient temperature 

 Operating humidity

 85

 %RH

 Non condensing

 Storage temperature

 -40 ~ 135

 ℃

 Moisture Sensitivity Level 

 3

-

 IPC/JEDEC J-STD-020 

Click on the contents file below to download the latest documentation for your product.

Unless otherwise noted, the documentation is in PDF format and requires Adobe Acrobat Reader to view.

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